OSAT & ATMP · Engineer
Advanced Packaging Engineer Programme
Deep dive into flip-chip, 2.5D/3D and heterogeneous integration for engineers moving into advanced packaging.
Who it is for
Process, equipment and packaging engineers with some OSAT or electronics manufacturing experience.
Eligibility: BE/BTech or higher; 1+ year of relevant experience preferred.
Modules
- 1Flip-chip bumping and assembly
- 2Underfill and warpage control
- 32.5D interposers and TSVs
- 43D stacking and hybrid bonding
- 5Heterogeneous integration and chiplets
- 6Thermal and reliability considerations
How Nirji Ready assessment works
Every candidate in this workforce programme is assessed for Nirji Ready certification against the competencies of the target role — knowledge checks, practical tasks on equipment or simulators, and observed floor behaviour such as cleanroom, ESD and safety discipline. Certification reflects demonstrated readiness, not attendance. It is a Nirji Semicon certification and is not an NSQF qualification.
About Nirji Ready →Questions
Yes, as a workforce programme: the Advanced Packaging Engineer Programme, assessed for Nirji Ready certification.