OSAT & ATMP · Technician
Assembly & Packaging Technician Programme
Build technician-level capability across die attach, wire bond, molding and finishing processes.
Who it is for
Diploma holders and operators ready to step up to technician roles.
Eligibility: Diploma in electronics, mechanical, mechatronics or equivalent.
Modules
- 1Package types and assembly flow
- 2Die attach and wire bond processes
- 3Molding, trim & form and marking
- 4Process parameters and SPC
- 5Equipment setup and basic troubleshooting
- 6Quality records and traceability
How Nirji Ready assessment works
Every candidate in this workforce programme is assessed for Nirji Ready certification against the competencies of the target role — knowledge checks, practical tasks on equipment or simulators, and observed floor behaviour such as cleanroom, ESD and safety discipline. Certification reflects demonstrated readiness, not attendance. It is a Nirji Semicon certification and is not an NSQF qualification.
About Nirji Ready →Questions
It is a workforce programme built around real line roles, with assessment for Nirji Ready certification rather than course completion.