OSAT & ATMP · Engineer
Semiconductor Packaging & OSAT Advanced Programme
An engineer-level programme covering the full span of IC packaging, OSAT operations and advanced packaging.
Who it is for
Graduate engineers and early-career professionals targeting OSAT and ATMP engineering roles.
Eligibility: BE/BTech, MSc or MTech in electronics, electrical, mechanical, materials or related disciplines.
Modules
- 1IC package fabrication
- 2OSAT processes
- 3ATMP techniques
- 4Multichip modules
- 5Quality assurance and reliability
- 6Advanced packaging
How Nirji Ready assessment works
Every candidate in this workforce programme is assessed for Nirji Ready certification against the competencies of the target role — knowledge checks, practical tasks on equipment or simulators, and observed floor behaviour such as cleanroom, ESD and safety discipline. Certification reflects demonstrated readiness, not attendance. It is a Nirji Semicon certification and is not an NSQF qualification.
About Nirji Ready →Related roles
- Equipment Engineer
- Process Engineer
- Quality Engineer
- Advanced Packaging Engineer
Questions
This engineer-level workforce programme covers IC packaging, OSAT and ATMP, and is assessed for Nirji Ready certification.